发明名称 |
ON-CHIP ELECTROMIGRATION MONITORING SYSTEM |
摘要 |
A packaged semiconductor chip is provided which includes a semiconductor chip and a package element. The semiconductor chip includes a plurality of semiconductor devices and a plurality of conductive features disposed at an exterior face of the semiconductor chip. The package element has a plurality of external features conductively connected to the plurality of conductive features of the semiconductor chip. The semiconductor chip includes a monitored element including a conductive interconnect that conductively interconnects a first node of the semiconductor chip to a second node of the semiconductor chip. A detection circuit in the semiconductor chip is operable to compare a variable voltage drop across the monitored element with a reference voltage drop across a reference element on the chip at a plurality of different times during a lifetime of the packaged semiconductor chip so as to detect when the resistance of the monitored element is over threshold.
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申请公布号 |
US2007164768(A1) |
申请公布日期 |
2007.07.19 |
申请号 |
US20060306985 |
申请日期 |
2006.01.18 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
HSU LOUIS L.;CRANFORD HAYDEN C.JR.;GLUSCHENKOV OLEG;MASON JAMES S.;SORNA MICHAEL A.;YANG CHIH-CHAO |
分类号 |
G01R31/26 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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