发明名称 |
Reduction of coefficient of friction for thermal addition curable solventless silicone release coating systems |
摘要 |
The invention is directed to a thermal addition curable solventless silicone release composition having a reduced coefficient of friction and improved slip characteristics. The invention is also directed to a method for producing a thermal addition curable solventless silicone release composition on a substrate by applying the thermal addition curable solventless release composition of the invention to a substrate and curing the coating on the substrate using heat. The invention is further directed to a thermal addition curable solventless silicone release coated article having a reduced coefficient of friction and improved slip characteristics.
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申请公布号 |
US7244800(B2) |
申请公布日期 |
2007.07.17 |
申请号 |
US20040008686 |
申请日期 |
2004.12.09 |
申请人 |
RHODIA CHIMIE |
发明人 |
RADL MICHAEL D.;ELLISON JAMES G.;STEWART NOLAN R. |
分类号 |
C08G77/08;B32B25/20;C08K5/01;C09D;C09D183/04 |
主分类号 |
C08G77/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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