发明名称 Low-profile articulated electronics enclosure with improved air coolant system
摘要 A system for housing electronic components includes an enclosure with an interior, a door for accessing the interior, and a chassis. The components are attached to the chassis, which is pivotally connected to the enclosure for movement between retracted and deployed positions. In the former, the chassis lies within the interior. In the latter, it lies rotated or swung out the front of the enclosure, allowing for the components to be accessed while minimizing the depth/size of the enclosure. The enclosure includes an air intake in the base of the enclosure, and air exhaust ports in the rear of the enclosure, both protected by baffles/louvers. Air is drawn through the intake (using a fan), up through the interior for cooling purposes, and out the rear of the enclosure through the exhaust ports. This pathway has been found to minimize the ingress of sprayed liquid, for compliance with IEC IP44.
申请公布号 US2007159791(A1) 申请公布日期 2007.07.12
申请号 US20060330975 申请日期 2006.01.11
申请人 LUCENT TECHNOLOGIES INC. 发明人 PONGRACZ DAVID J.;SHEMAN RODNEY M.
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
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