发明名称 FILM-FORMING COMPOSITION
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a film-forming composition for forming an insulation film having good film characteristics such as dielectric constant, barrier properties against metal diffusion, to provide an insulation film obtained by using the film-forming composition and an electronic device equipped with the insulation film. <P>SOLUTION: This film-forming composition contains a polymer of a compound expressed by general formula (I): (X)<SB>m</SB>-Q-(Y)<SB>n</SB>, wherein Q represents five- or six-membered nitrogen-containing heterocycle; X represents an arbitrary substituent; m denotes an integer of 0-10; n denotes an integer of 1-10; and Y represents a prescribed group. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007177043(A) 申请公布日期 2007.07.12
申请号 JP20050375704 申请日期 2005.12.27
申请人 FUJIFILM CORP 发明人 MORITA KENSUKE
分类号 C08F38/00;C07D263/56;H01L21/312 主分类号 C08F38/00
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