| 摘要 |
An integrated circuit package having metallic members intruding into solder balls. The integrated circuit package includes an integrated circuit, an encapsulant, a plurality of solder balls and a plurality of metallic members. A plurality of bonding pads is disposed on an integrated circuit. The encapsulant is made of an insulation material and covers the integrated circuit. A plurality of slots is formed on a bottom surface of the encapsulant. The solder balls are respectively disposed in the slots on the bottom surface of the encapsulant and protrude from the bottom surface of the encapsulant. Each metallic member has a first end, which is electrically connected to a bonding pad of the integrated circuit, and a second end, which protrudes from the bottom surface of the encapsulant and is bent to intrude into a corresponding one of the solder balls to fix the solder ball. |
