| 摘要 |
PROBLEM TO BE SOLVED: To provide a film laminate capable of being simply heat-sealed and having low steam permeability, and a packaging bag for electronic material using it. SOLUTION: The film laminate includes a polyethylene film layer (layer A), a resin film layer (layer B) having an inorganic compound vapor deposition layer, and a resin film layer (layer C) having a metal vapor deposition layer, wherein the polyethylene film layer (layer A) is set as a surface layer. COPYRIGHT: (C)2007,JPO&INPIT |
