| 摘要 |
<p>A substrate cutting method comprises the steps of, attracting a first mother substrate (300) including conjoined first and second substrates (300a, 300b) over a vertically and laterally movable stage (321), feeding the stage (321) to a scriber (330), and forming first cracks in the second substrate (300b) of the first mother substrate (300) along separation lines, returning the stage (321) to an original position of the stage (321), upwardly moving a conveyor belt (323), and transferring the first mother substrate (300) to the conveyor belt (323), downwardly moving the conveyor belt (323), transfening the first mother substrate (300) to a scribing belt (331) of the scriber (330), and forming second cracks in the first substrate (300a) of the first mother substrate (300) along separation lines, feeding the first mother substrate (300) formed with the first and second cracks to a breaking belt (341); and separating the first mother substrate (300) fed to the breaking belt (341) into unit liquid crystal panels.</p> |
