SUBSTRATE SUPPORTING MECHANISM, RESIN APPLYING DEVICE, RESIN CURING DEVICE AND SUBSTRATE PROCESSING SYSTEM

摘要

PROBLEM TO BE SOLVED: To provide a substrate supporting mechanism provided with a constitution capable of optimally supporting a substrate even when an electronic component is mounted in which damage or faulty mounting is readily generated upon transportation. SOLUTION: The substrate supporting mechanism 25 for supporting a tape-type substrate 2 is transferred into a predetermined direction, and has the electronic component 3 mounted thereon. The mechanism is equipped with a substrate guiding unit 41 for guiding both ends in the widthwise direction of the substrate 2, and a substrate abutting unit 42e for supporting the substrate 2 by being abutted against a position avoiding a mounting part 2a on which the electronic component 3 is mounted. COPYRIGHT: (C)2007,JPO&INPIT