SOLDERING METHOD, SEMICONDUCTOR MODULE MANUFACTURING METHOD AND SOLDERING APPARATUS

摘要

Provided is a soldering method for soldering an electronic component on a circuit board. The soldering method is provided with a step of placing an electronic component (12) on a bonding section (13) on a circuit board (11) through a solder (H), a step of placing a spindle (35) on the electronic component, and a step of heating and melting the solder while pressing the electronic component toward the circuit board by the spindle. The spindle is separated from the electronic component during a period from a time when the molten solder is wet spread between the bonding section and a bonding plane of the electronic component to a time when the temperature of the solder is high after the molten solder is solidified.