| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wafer-type temperature sensor of a simple circuit capable of eliminating the need for supply of electric power, adapting to automation, improving resistance to heat, and measuring the temperature distribution of a wafer. <P>SOLUTION: The wafer-type temperature sensor 10 is provided with the wafer 1 and a plurality of temperature sensors 2a, 2b, ..., each being arranged with the upper surface of the wafer 1 partitioned into a plurality of regions. The temperature sensors 2a, 2b, ... are each provided with a surface acoustic wave device for sending back frequency signals, based on the temperature of a corresponding region within a frequency band different region by region, in response to input of high-frequency signals. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
