| 摘要 |
A stacked die package comprises a first die on a substrate, a die attach layer superjacent to the first die, and a second die on the die attach layer. The die attach layer comprises a die attach material having a glass transition temperature substantially in the range of 150-180° C. Raising the glass transition temperature reduces the mismatch in the coefficients of thermal expansion (CTE) between the die attach and the mold compound that surrounds the first die in the package.
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