| 摘要 |
A method for designing the interconnection of a semiconductor IC(Integrated circuit) is provided to minimize a layer modification and reduce undesired circuit area by changing a positioning direction of a contact part(CC), thereby reducing the manufacturing cost. A wiring designing method for interconnecting a first wiring and a second wiring comprises the following steps of: positioning the second wiring on the first wiring; a contact part for interconnecting the first and the second wiring; positioning the contact part(CC) corresponding to a length direction of the first wiring.
|
