| 摘要 |
A vacuum sealing gasket of semiconductor equipment is provided to minimize the variation of a vacuum state due to the deformation of an O-ring by stabilizing the vacuum state at a connection portion of a vacuum pipe using an improved center ring structure composed of two second O-rings and one first O-ring. A vacuum sealing gasket of semiconductor equipment includes a pair of SUS pipes, a fixing ring, a first O-ring, a pair of second O-rings, and a fixing member. The pair of SUS pipes(11) are used for connecting two pipes with each other. The fixing ring(15) is embedded in the SUS pipe. The fixing ring includes a through hole at the center. The first O-ring(13a) is installed at a peripheral portion of the fixing ring. The pair of second O-rings(13b) are installed at the peripheral portion of the fixing ring. The second O-rings are symmetrically arranged with each other. The fixing member is used for attaching the SUS pipe. The first and second O-rings are made of rubber. The fixing member includes a clamp.
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