PRINTED WIRING BOARD, CONNECTION STRUCTURE THEREOF, AND CONNECTION METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a printed wiring board which can prevent a conductor pattern from being exposed due to the confinement of air caused by sneaking of an underfill during the application of the underfill or the shortage of charge in the underfill. SOLUTION: A plurality of conductor patterns 12 and a dummy pattern 13 for uniforming distances d1 and d2 among the conductor patterns 12 are provided at the joint 15 of a first printed wiring board 10. Thus, the conductor pattern can be prevented from being exposed due to the confinement of air caused by sneaking of an underfill during the application of the underfill or the shortage of charge in the underfill. COPYRIGHT: (C)2007,JPO&INPIT