| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting diode device and a manufacturing method thereof wherein the number of its manufacturing processes can be cut down in comparison with conventional ones, and its productivity can be improved. <P>SOLUTION: In the manufacturing method of the light emitting diode device, a resin layer 6a for forming an insulating layer and a conductor layer 7a for forming a wiring layer 7 are provided on a metal substrate 2. The metal substrate 2 is so mounted on a pressing mold 10 as to start the pressurization of the metal substrate 2, the resin layer 6a, and the conductor layer 7a by pressing them in the state of heating them at a first temperature, and as to increase the pressure of the pressurization while performing a temperature rise to a second temperature higher than the first temperature. Consequently, a recess 3 is formed in the metal substrate 2; and the metal substrate 2, the resin layer 6a, and the conductor layer 7a are bonded to each other. Hereupon, a resin having such a temperature dependency that its thermal expansion coefficient is so once reduced between the first and second temperatures as to be increased thereafter is used as the resin layer 6a. <P>COPYRIGHT: (C)2007,JPO&INPIT |
