| 摘要 |
PROBLEM TO BE SOLVED: To achieve a semiconductor chip capable of reducing the area of a substrate surface. SOLUTION: Mounting sections 21b, 21b of a cap 21 covering a sensor section 14 of the semiconductor chip 19 extend from the ends of the mounting sections 21b, 21b to the inside of the scribes 15, 15 and are attached on internal wall surfaces 15a, 15a of the semiconductor chip 19 side, thereby mounting the cap 21. Thus, a large region for mounting the cap 21 is not required to be provided on a segmented substrate surface 13a of the semiconductor chip 19. Further, since a bonding member such as an adhesive may not overflow onto the substrate surface 13a and may not reach the sensor section 14 when the adhesive is used to mount the cap 21, a region provided considering the overflow of the adhesive to the substrate surface 13a is not required to be ensured. Accordingly, the semiconductor chip 19 capable of reducing the area of the substrate surface 13a can be realized. COPYRIGHT: (C)2007,JPO&INPIT
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