| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor element mounting multilayer printed wiring board capable of securing electrical connection property and reliability and hardly influenced by a signal delay, and to provide a a method of manufacturing the same. <P>SOLUTION: In the multilayer printed wiring board in which a resin insulating layer and conductive layers are alternately laminated on other resin insulating layer having a semiconductor element housed therein, and electrical connection between these conductive layers is performed through a via hole formed on the resin insulating layer or a through hole formed by penetrating all layers, a first via hole is formed on the resin insulating layer in which the semiconductor element is housed, and a second via hole connected to a connection pad of the semiconductor element and a third via hole connected to the first via hole are formed on other resin insulating layer formed adjacently to the resin insulating layer. Further, a conductive circuit for electrically connecting the second via hole and the third via hole, or the conductive circuit for connecting the second via hole to a through hole conductor are formed. <P>COPYRIGHT: (C)2007,JPO&INPIT |
