| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an amine-curable epoxy resin composition having excellent storage stability and solder connectability and suitable for the noflow production of a flip-chip semiconductor device. <P>SOLUTION: The liquid epoxy resin composition contains (A) a liquid epoxy resin, (B) an amine-based curing agent, (C) 1-20 pts.mass of a sulfur-containing phenol compound based on 100 pts.mass of the sum of the components (A) and (B), and (D) 50-900 pts.mass of an inorganic filler based on 100 pts.mass of the epoxy resin (A). <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
