| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide power conversion equipment which can elevate the cooling efficiency of a semiconductor module while preventing an overload to the semiconductor module and a cooling pipe. <P>SOLUTION: This power conversion equipment 1 has a semiconductor stacked unit 2 where semiconductor modules 21 constituting a part of a power converting circuit and cooling pipes 22 for cooling the semiconductor modules 21 are stacked alternately. A pressurizing member 3 for pressurizing the semiconductor stacked unit 2 in its stacking direction is arranged at the end in the stacking direction of the semiconductor stacked unit 2. The pressurizing member 3 has an abutting plate 31 which has an abutting face 311 to abut on the main face 221 of the cooling pipe 22 and a spring member 32 which is arranged at a face opposite to the abutting face 311 of the abutting plate 31. The spring member 32 has such hysteresis that an elastic force generated when the spring member is transformed in the direction of pressurization becomes larger than an elastic force when it is restored in the direction of depressurization. <P>COPYRIGHT: (C)2007,JPO&INPIT |
