发明名称 Integrated semiconductor device and method of manufacturing thereof
摘要 An integrated semiconductor device containing semiconductor elements that have respective desired on-resistances and breakdown voltages achieves appropriate characteristics as a whole of the integrated semiconductor element. The integrated semiconductor device includes a plurality of semiconductor elements formed in a semiconductor layer and each having a source of an n type semiconductor, a drain of the n type semiconductor and a back gate of a p type semiconductor between the source and the drain. At least a predetermined part of the drain of one semiconductor element and a predetermined part of the drain of another semiconductor element have respective impurity concentrations different from each other.
申请公布号 US2007148874(A1) 申请公布日期 2007.06.28
申请号 US20070703628 申请日期 2007.02.08
申请人 RENESAS TECHNOLOGY CORP. 发明人 NITTA TETSUYA;TERASHIMA TOMOHIDE
分类号 H01L21/336;H01L21/8234;H01L21/266;H01L21/84;H01L27/088;H01L27/12;H01L29/786 主分类号 H01L21/336
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