| 摘要 |
The boring method of a printed wiring board comprising a first step for forming a through hole (22) in a board (20) for BOC by lowering a punch (622) while holding the board (20) for BOC between a stripper plate (630) and a die plate (642), a second step for feeding compressed air to the through hole (22) from the punching die (620) side through a punch hole (632) after the punch (622) is elevated while holding the board (20) for BOC between the stripper plate (630) and the die plate (642), and a third step for lowering the punch (622) again while holding the board (20) for BOC between the stripper plate (630) and the die plate (642). In this boring method, boring chips generated on the inner surface of the through hole (22) can be removed completely, adhesion of boring chips to the upper surface of the board (20) for BOC can be suppressed, and the mechanism and method for forming the through hole (22) can be simplified easily. |
