| 摘要 |
Disclosed is a conductive metal ink which has excellent adhesion to various bases such as glass substrates and enables formation of fine wiring or electrodes. Also disclosed is a conductive ink which can be used in inkjet systems. Specifically disclosed is a conductive ink containing a solvent, a metal powder and an adhesion improver which is characterized in that the adhesion improver is composed of one or more substances selected from the group consisting of silane coupling agents, titanium coupling agents, zirconia coupling agents and aluminum coupling agents. By adjusting the surface tension of the solvent to be within the range from 15 mN/m to 50 mN/m using a surface tension regulator, the conductive ink is formed into an ink which can be suitably used in inkjet systems or the like.
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