| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board with an ultrafine wiring pattern buried in an insulator. SOLUTION: The wiring board manufacturing method comprises a step of contacting and pressing a precision press mold with a press mold emboss pattern formed on a male mold composed of hard members on the surface of a support, to a metal film on an organic insulating base composed of the metal film laminated on a resin base of an organic insulating base, thereby forming recesses corresponding to the press mold emboss pattern formed on the male mold toward the deep of the organic insulating base from the metal film of the organic insulating base; then removing the precision press mold; forming a thicker metal plating layer than the depth of the recesses formed on the metal film of the organic insulating base; and polishing the metal plating layer until the organic insulating base is exposed from the metal plating layer surface, thereby forming a wiring pattern with the plating metal filled in the recesses on the organic insulating base. Thus, a wiring board is manufactured with a wiring pattern buried in the organic insulating base. COPYRIGHT: (C)2007,JPO&INPIT
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