Method of producing a semiconductor device, and wafer-processing tape

摘要

A wafer-processing tape, having a removable adhesive layer( 2 ), and an adhesive layer ( 3 ), formed on a substrate film( 1 ), wherein the tape is used in a process involving the steps of: grinding a back face of a wafer circuit substrate ( 5 ) having convex-type metal electrodes ( 4 ), and dicing the wafer circuit substrate into chips, in a state that the tape is adhered to the wafer circuit substrate; and picking up the chips, in which the chips are picked up in a state that the adhesive layer ( 3 ) is peeled from the substrate film ( 1 ) but is bonded to the individual chip.