发明名称 THIN-FILM PATTERN FORMATION APPARATUS AND ITS FORMATION PROCESS
摘要 <P>PROBLEM TO BE SOLVED: To provide a thin-film pattern formation apparatus and its formation process, which simplify a formation step of a metal thin-film line, shorten the time required for the process, and also simplify its production equipment. <P>SOLUTION: The present invention comprises a chamber case, which keeps the internal space in communication with the outside and which is provided with a first fixing unit and a second fixing unit, a pattern electrode plate which is provided with bump electrodes with a shape of a predetermined pattern and is fixed on the first fixing unit, the second fixing unit is provided within the chamber case with a predetermined space from the pattern electrode plate and to which a substrate coated with a metal nano-substance in the form of ink is fixed, a power supply unit for supplying power to the first fixing unit and the second fixing unit so that they can form electrodes, and a drying unit for drying the metal nano-substance in the form of ink patterned on the substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007152346(A) 申请公布日期 2007.06.21
申请号 JP20060326109 申请日期 2006.12.01
申请人 TOP ENGINEERING CO LTD 发明人 LEE CHANG-BOK;SON JUNG-WOONG
分类号 B05C9/12;B05D3/14;B05D7/24;H01L21/288 主分类号 B05C9/12
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