| 摘要 |
PROBLEM TO BE SOLVED: To provide a single wafer cleaning device which can avoid additional wafer charge. SOLUTION: The wafer cleaning device 10 comprises a chuck 12 for retaining a wafer 11 on the level, and a stage 13 for the wafer 11 retained by the chuck 12. The surface of the stage 13 contains a nozzle hole for cleaning solution supply, a nozzle hole for rinse solution supply and a vent 24 for waste liquid exhaust. For cleaning or rising, the cleaning solution or rinse solution is retained in a clearance between the wafer surface 11a and the stage 13 without rotating the wafer 11. COPYRIGHT: (C)2007,JPO&INPIT
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