发明名称 RESIN-MOLDED ARTICLE FOR METAL PLATING AND INJECTION-MOLDED CIRCUIT COMPONENT USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a resin-molded article for metal plating which can be preferably used as a primary molded-article of MID because the adhering strength of a metal layer formed on the surface of the resin-molded article can be improved while maintaining high flexural strength and advantageous dimensional strength of the resin-molded article; and MID formed using the resin-molded article for plating as a primary molded article. SOLUTION: This resin-molded article for metal plating is formed using a resin composition comprising a PPS resin, spherical silica and a whisker in predetermined comprising ratios. The surface of the resin-molded article is etched so that the area ratio of a black region in an image of black and white 2 values which is produced by 2-steps signal-resolution treating a gray scale image obtained by photographing the surface of the resin-molded article using SEM, is 10 to 40%. MID is produced using the resin-molded article for a plating as a primary molded-article, wherein, a conductive wiring is formed on the surface of the primary molded-article which has been subjected to an etching treatment. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007154071(A) 申请公布日期 2007.06.21
申请号 JP20050352528 申请日期 2005.12.06
申请人 SUMITOMO ELECTRIC IND LTD 发明人 OKABE SHOHEI;KARIYA TAMIO
分类号 C08J7/00;C08K7/02;C08K7/18;C08L81/02;C23C18/24;H05K3/18 主分类号 C08J7/00
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