| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To miniaturize and lighten a temperature compensation circuit substrate excellent in a thermal response to a change in temperature. <P>SOLUTION: Wiring patterns 15, 16 of a thick film ceramic circuit substrate C are formed on the upper surface of the ceramic substrate 1. And a positive characteristic thermistor P is arranged so that it is electrically connected with the wiring pattern 16. A wiring pattern 17 of a flexible circuit substrate F is formed on the upper surface of a flxible polyimide substrate 8. The substrate C and the substrate F are bonded so that the positive characteristic thermistor P is sandwiched between the surface with the pattern 16 of the substrate C formed and the surface opposite to the surface with the pattern 17 of the substrate F formed. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
