| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wafer-manufacturing method capable of dividing a wafer into respective chips along a scheduled division line, and maintaining them at a prescribed interval. <P>SOLUTION: In the method for dividing a wafer, devices are provided at a plurality of regions along the scheduled division line. The method comprises an altered layer formation process for forming an altered layer by applying laser beams at a wavelength, having transmission properties to the wafer along the scheduled division line; a wafer support process for sticking the rear of the wafer to the front of a pressure-sensitive adhesive tape, where the adhesive force decreases by the application of ultraviolet rays, after fitting to an annular frame; and an inter-chip interval formation process for applying ultraviolet rays to the pressure-sensitive adhesive tape, to which the wafer is stuck and reducing the adhesive force of the pressure-sensitive adhesive tape, allowing a shrinkage region to shrink between the inner periphery of the annular frame in the pressure-sensitive adhesive tape and a region to which the wafer is stuck, and breaking the wafer into each chip and expanding the interval among chips along the scheduled division line, where the altered layer is formed. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
