发明名称 |
LEAD FRAME , LIGHT EMITTING DEVICE PACKAGE USING THE SAME AND FABRICATING METHOD THEREOF |
摘要 |
A lead frame, a light emitting device package using the same and a manufacturing method thereof are provided to improve the reliability and to perform an automated process by preventing the deviation of a lens from a package body. A lead frame includes a first frame and a second frame. The first frame(100) is composed of a first lead and a second lead. The first lead is connected with a mounting plate for mounting a light emitting element. The second lead is spaced apart from the mounting plate. The second frame(200) is stacked on the first frame. The second frame is connected with a lens holder, wherein the lens holder includes an opening portion capable of exposing partially the mounting plate and the second lead to the outside.
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申请公布号 |
KR20070063743(A) |
申请公布日期 |
2007.06.20 |
申请号 |
KR20050123888 |
申请日期 |
2005.12.15 |
申请人 |
LG ELECTRONICS INC.;LG INNOTEK CO., LTD. |
发明人 |
LEE, SANG KYUN |
分类号 |
H01L33/62;H01L33/58 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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