发明名称 LEAD FRAME , LIGHT EMITTING DEVICE PACKAGE USING THE SAME AND FABRICATING METHOD THEREOF
摘要 A lead frame, a light emitting device package using the same and a manufacturing method thereof are provided to improve the reliability and to perform an automated process by preventing the deviation of a lens from a package body. A lead frame includes a first frame and a second frame. The first frame(100) is composed of a first lead and a second lead. The first lead is connected with a mounting plate for mounting a light emitting element. The second lead is spaced apart from the mounting plate. The second frame(200) is stacked on the first frame. The second frame is connected with a lens holder, wherein the lens holder includes an opening portion capable of exposing partially the mounting plate and the second lead to the outside.
申请公布号 KR20070063743(A) 申请公布日期 2007.06.20
申请号 KR20050123888 申请日期 2005.12.15
申请人 LG ELECTRONICS INC.;LG INNOTEK CO., LTD. 发明人 LEE, SANG KYUN
分类号 H01L33/62;H01L33/58 主分类号 H01L33/62
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