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发明名称
MANUFACTURING SYSTEM OF MULTI LAYER PCB WITH INNER VIA HOLE AND THE METHOD THEREOF
摘要
申请公布号
KR100730593(B1)
申请公布日期
2007.06.20
申请号
KR20050083169
申请日期
2005.09.07
申请人
发明人
分类号
H05K3/46
主分类号
H05K3/46
代理机构
代理人
主权项
地址
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