| 摘要 |
The invention relates generally to an orthopedic insole arrangement comprising a bottom insole (110), a top insole (112) and a set of overload tactile feedback elements, e.g. pins (115, 116, 117, 118, 119) forming an orthopedic insole kit. The assembled insole arrangement gives a tactile overload feedback to patients during rehabilitation, such as during walking, allowing an optimised healing process. The insole (913) may comprise a bottom insole (110) having at least one hole (120, 130, 140, 150, 160, 165, 170, 175, 180, 185), and a top insole (112) with matching hole/s (121, 131, 141, 151, 161, 166, 171, 176, 181, 186), wherein at least one pin (115, 116, 117, 118, 119) is installed to slide vertically inside the hole (121, 131, 141, 151, 161, 166, 171, 176, 181, 186), thereby protruding from the insole (913) at some compression of the insole (913). |
