APPARATUS AND METHOD FOR ARRANGING DEVICES FOR PROCESSING

摘要

An apparatus and a method for arranging devices for processing are provided to arrange and align effectively semiconductor devices including surface components. A device supporting unit(14) includes a set of protrusions contacting a surface of a semiconductor device to support the semiconductor device on a plane. The protrusions are arranged to avoid contact with surface components on the surface of the semiconductor device. A clamping device includes a first set of clamps(20) for gripping the semiconductor device along a first axis and a second set of clamps(22) for gripping the semiconductor device along a second axis perpendicular to the first axis to grip the semiconductor device supported on the plane.