| 摘要 |
An improved chip package structure includes a chip carrier, a chip, a plurality of pins, a plurality of leads, a package body and a heat spreader. The chip is fixed on the chip carrier. The leads are electrically connected between the chip and the pins. The package body is packaged outside the chip carrier, the chip and the leads. The heat spreader is disposed in the package body. The heat spreader contacts the chip carrier, and is partially exposed out of a face (top face) of the package body. Heat generated by the chip can thus be transmitted to a heatsink via the chip carrier and the heat spreader so as to discharge a large amount of heat generated by the chip to the outside. The improved chip package structure has a good heat conduction efficiency and an effectively enhanced heat spreading efficiency.
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