| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce a parasitic capacitance of a floating diffusion part while adopting direct sticking structure. <P>SOLUTION: A light receiving part 21 and the floating diffusion part 22 are separately formed on a semiconductor substrate 20 (S11), and a light-transmitting adhesive agent 31 is applied to a region corresponding to the light receiving part 21 on the semiconductor substrate 20 (S22), and a light-transmitting plate material 30 is stuck on the semiconductor substrate 20 to which the light-transmitting adhesive agent 31 is applied (S23). Here, before applying the light-transmitting adhesive agent 31, a weir portion 24 on the semiconductor substrate 20 is so formed that the light-transmitting adhesive agent 31 applied to the region corresponding to the light receiving part 21 is prevented from flowing into the region corresponding to the floating diffusion part 22 on the semiconductor substrate 20 (S18). <P>COPYRIGHT: (C)2007,JPO&INPIT |
