| 摘要 |
<p>A web (L) produced by temporarily bonding a band-like tape base (TB) having a die-bonding sheet section (DS) having a size corresponding to the shape of a semiconductor wafer (W) to a band-like releasable sheet (S) is fed. A cut detecting device (14) detects during the feeding whether or not any cut (C) is formed in the peripheral side of the die-bonding sheet (DS). If the cut detecting device (14) detects that a cut (C) is formed, a die cut device (13) passes the web (L) as it is without forming a cut (C). If the cut detecting device (14) does not detect any cut (C), the die cut device (13) forms a cut (C) to produce a bonding tape (DDT). The bonding tape (DDT) is released by a releasing device (15) and bonded to a ring frame (RF), with the die-bonding sheet (DS) aligned with the semiconductor wafer (W).</p> |
