| 摘要 |
A CVD apparatus is provided to selectively replace or repair the damaged part of a shaft by including a spindle shaft composed of a body part and a head part capable of being separated from the body part such that the spindle shaft transfers the rotation force of a driving motor to a spindle fork. A plurality of semiconductor substrates are received in a process chamber having a plurality of stations wherein process gas is supplied to the process chamber to form a layer on each substrate by a CVD method. A spindle fork supports the substrate in a manner that the substrates are separately disposed in a circumferential direction with respect to the center axis of the spindle fork, installed in the process chamber. A spindle shaft assembly(420) transfers rotation force to selectively locate the substrates in the stations, connected to the spindle fork and including a body part(424) and a head part(422) that is detachably coupled to the body part. A process gas supplying part supplies the process gas to each station. A heating part heats the substrates to a process temperature. A vacuum supply part adjusts the pressure in the process chamber and removes the byproducts generated during the fabricating process.
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