| 摘要 |
In the method at least two surfaces (10,12';17,17') to be joined in a permanent mechanical manner are provided. Then a bonding material of non-conducting substance is applied to at least one of the surfaces (12',17') to be joined mechanically, wherein the bonding material comprises at least a first component (A or B) and, if desired, also a second component (C) in a disperse distribution. The first component of the bonding material is chosen from the group of electrically non-conducting enamels and heat-resistant cements being compatible with the surface. The second component of the bonding material is chosen from the group of electrically non-conducting grains having a given range of grain size and also having a melting point higher than that of the chosen first component and being solvable to a negligible extent in the chosen first component at the melting point thereof and being wettable by the chosen first component. In the next step a structure ready for forming a joint is prepared by arranging said surfaces in an indirect contact with each other through the applied layer of the bonding material. Finally, the obtained structure is baked by heating it essentially to the melting point of the first component of the bonding material and maintaining it at the requisite temperature for a given period of time, whereby a joint of a non-conducting substance with a given thickness is formed from the bonding material between the surfaces.
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