| 摘要 |
A multilayered circuit substrate and a semiconductor package using the multilayered circuit substrate are provided to increase the number of bonding pads arranged on the circuit substrate without reducing the pitch of the bonding pads, and to further increase the routing feasibility of high speed signals by the use of signal wirings instead of vias. An embodiment may include bonding pads provided on different layers, in which the bonding pads arranged on one layer are staggered with the bonding pad arranged on another layer. Ball lands may be connected to the bonding pads using wirings wherein the bonding pads connected to the signal wirings may be provided on the same layer as the corresponding ball lands. |
