发明名称 |
THERMAL STORAGE MATERIAL MICROCAPSULE, THERMAL STORAGE MATERIAL MICROCAPSULE DISPERSION AND THERMAL STORAGE MATERIAL MICROCAPSULE SOLID MATERIAL |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermal storage material microcapsule carrying out heat absorption of heat energy during melting and heat radiation of the heat energy during solidification in each different temperature region and having high heat quantity and excellent thermal storage performances without using a plurality of kinds of organic thermal storage materials in a thermal storage material microcapsule encapsulating the organic thermal storage material. <P>SOLUTION: The thermal storage material microcapsule encapsulating the organic thermal storage material in the microcapsule is obtained by setting a difference between the melting temperature and the solidifying temperature of the organic thermal storage material in a state encapsulated in the microcapsule at ≥5°C. The purity of the organic thermal storage material is more preferably set at ≥91% or the acid value is more preferably set at ≤1. The hydroxyl value is more preferably set at ≤3. The average particle diameter of the thermal storage material microcapsule is preferably set at ≥0.1 to ≤7 μm. The film of the thermal storage material microcapsule is preferably formed by an in-situ polymerization method. <P>COPYRIGHT: (C)2007,JPO&INPIT |
申请公布号 |
JP2007137991(A) |
申请公布日期 |
2007.06.07 |
申请号 |
JP20050332585 |
申请日期 |
2005.11.17 |
申请人 |
MITSUBISHI PAPER MILLS LTD |
发明人 |
IKEGAMI KOSHIRO;MORI SHINKICHI;ISHIGURO MAMORU |
分类号 |
C09K5/06;F28D20/00 |
主分类号 |
C09K5/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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