AU-SN ALLOY BUMP WITHOUT INCORPORATING LARGE VOID AND METHOD FOR MANUFACTURING THE SAME,申请号JP20050336084-传众专利搜索

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发明名称	AU-SN ALLOY BUMP WITHOUT INCORPORATING LARGE VOID AND METHOD FOR MANUFACTURING THE SAME
摘要	<P>PROBLEM TO BE SOLVED: To provide a bump made of an Au-Sn alloy without incorporating large voids and a manufacturing method of the bump. <P>SOLUTION: This bump made of the Au-Sn alloy without incorporating the large voids has composition composed of, by mass, 20.5-23.5% Sn, the balance Au with inevitable impurities and has structure in which Sn-rich primary crystal phase of 0.5-30 area% is crystallized in a ground material. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号	JP2007136523(A)	申请公布日期	2007.06.07
申请号	JP20050336084	申请日期	2005.11.21
申请人	MITSUBISHI MATERIALS CORP	发明人	ISHIKAWA MASAYUKI;OBINATA MASAYOSHI;MISHIMA TERUSHI
分类号	B23K35/30;B23K35/22;C22C5/02;H01L21/60	主分类号	B23K35/30
代理机构		代理人
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