| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device for sufficiently ensuring a heat dissipation characteristic and improving mounting reliability, and to provide a manufacturing method thereof. <P>SOLUTION: A shift of a die pad (heat sink) 11 resultantly causing a bend in the semiconductor device after sealing the die pad 11, an adhesive 12, a semiconductor element 4, a wire 2, and inner leads 3i with a sealing resin 10 is suppressed and controlled by forming a projection 5b on the die pad 11, for distributing impregnation pressure at resin impregnation so as to reduce the bend, thereby stabilizing substrate mounting. <P>COPYRIGHT: (C)2007,JPO&INPIT |
