| 摘要 |
PROBLEM TO BE SOLVED: To improve the stability of electric conduction based on solder or the like, to achieve high density packaging, to shorten cyclic time, to achieve void-free packaging, to reduce a warp in a substrate, and so on. SOLUTION: A method for packaging an electronic component 26 on which metallic bumps are formed comprises a process for applying thermosetting resin 30 to the surface of a substrate 21, a process for heating the electronic component 26 up to a maximum temperature in the method in a state of holding the electronic component 26 on a heat and press bonding apparatus 27, a bonding process for pressing the bumps 29 of the electronic component to electrodes 22 formed on the substrate 21 at the maximum temperature, a process for reducing the temperature from the maximum temperature up to a final temperature while holding the state and setting the thermosetting resin 30 during the temperature reduction, and a process for separating the heat and press bonding apparatus 27 from the electronic component 26 when the temperature reaches the final temperature. COPYRIGHT: (C)2007,JPO&INPIT |
