Conductive fine particles, method for plating fine particles, and substrate structural body

摘要

This invention provides a conductive fine particle having an ability of relaxing the force applied to a circuit of a substrate or the like. A conductive fine particle, comprising a core fine particle made of resin with its surface covered with at least one metal layer, wherein the resin has a coefficient of linear expansion of from 3x10^-5 to 7x10^-5 (1/K).