Semiconductor device with recessed post electrode

摘要

A semiconductor device includes a semiconductor chip which has a top surface, a conductive member which includes a first portion which is located on the electrode pad and a second portion which is extended from the first portion, and a sealing resin which seals the top surface of the semiconductor chip and the conductive member. A top surface of the second portion is exposed from the sealing resin and a part of the top surface of the second portion is concaved from a surface of the sealing resin. An external electrode is formed on the top surface of the second portion.