| 摘要 |
An apparatus for baking a wafer is provided to improve the distribution of a bake temperature by setting exactly quickly a target temperature to a wafer using heat coils arranged in a chamber lid as well as a plate. An apparatus for baking a wafer includes a chamber for defining a sealed space, a plate, and a chamber lid. The plate(110) is installed in the chamber to load stably a wafer. The plate includes a first heat coil(118) for transferring the heat to the wafer. The chamber lid(120) is used as an upper portion of the chamber. The chamber lid includes a second heat coil(128) for transfer the heat to the atmosphere of the chamber. The first and second heat coils of the plate and chamber lid are simultaneously heated.
|
