Method of forming a composite standoff on a ciruit board
摘要
<p>A composite standoff is formed on a circuit board during the processing of the circuit board while an array of electrical circuit traces including contact pads are formed, portions of the electrical circuit traces are covered by a solder mask, and legend ink is applied to the circuit board for locating electronic components on the circuit board without any need for an additional step.</p>
申请公布号
EP1791406(A1)
申请公布日期
2007.05.30
申请号
EP20060077047
申请日期
2006.11.17
申请人
DELPHI TECHNOLOGIES, INC.
发明人
CHAN, SU LIANG;NAH, CHIH KAI;PAN, BINGHUA;SCHOFIELD, ROBERT A.;CHEOK, CHENG GEK;CHENGALVA, MAHESH K.