| 摘要 |
In a peeling tape attaching method for attaching a peeling tape (4) on a surface protective film (11) attached on the surface of a wafer (20), the wafer is supported on a movable table (31) with the surface protective film up and the peeling tape is supplied on the surface protective film of the wafer. The movable table is moved in such a manner that an end (28) of the wafer is located under a peeling tape attaching unit (46), and pressure is exerted by pressing the peeling tape attaching unit against the surface protective film of the wafer via the peeling tape. After that, the movable table is moved toward the other end (29) of the wafer, and upon movement of the movable table, by a predetermined distance, from the peeling tape attaching unit, the pressure is canceled. As a result, the wafer is prevented from cracking at the time of attaching the peeling tape. Further, a peeling tape attaching apparatus for carrying out this method is provided. |
