Method of deposition of metal into cavities on a substrate

摘要

A process for filling cavities in a flat surface on a substrate by metal deposition which includes depositing a film of metal onto the flat surface and cavities in a substantially perpendicular direction to the surface, and simultaneously re-sputtering and deposited film on the flat surface by ion beam milling at an angle to the surface of the substrate for achieving the deposition of metal into the cavities and filling the cavities without leaving any film on the flat surface.