Apparatus and method for mold temperature adjustment

摘要

A mold temperature adjusting apparatus comprising a high temperature medium supply system (41) for supplying a medium of high temperature into a mold (2) and low temperature medium supply system (31) for supplying a medium from a low temperature medium tank (3) into said mold (2). A low temperature medium by-pass system (40) connects said low temperature medium supply system (31) and said low temperature medium return system (35) to each other so that a control of a mold temperature of said mold (2) is effected by the medium of high temperature and the medium of low temperature of predetermined temperatures being selectively caused to flow in a heat medium passage provided in said mold (2). A mold temperature sensor (62) is provided for actually measuring a mold temperature, and a mold temperature control means (132) is provided for performing a control including the steps of, while said mold (2) is heated, stopping supply of the high temperature heat medium into said mold (2) when the mold temperature is elevated to a high temperature medium stop temperature TH-”TH (a heating over-shooting temperature correction value ”TH subtracted from a predetermined resin filling start mold temperature TH), and, while said mold (2) is cooled, stopping supply of the low temperature heat medium into said mold (2) when the mold temperature is lowered to a low temperature medium stop temperature TL+”TL1 (a cooling under-shooting temperature correction value ”TL1 added to a predetermined mold opening start temperature TL).